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首页 > 商务会议 > 学术会议会议 > 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) 更新时间:2019-09-04T09:41:18

2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC)
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2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) 已截止报名

会议时间: 2019-09-16 09:00至 2019-09-17 18:00结束

会议地点: Pisa  详细地址会前通知  None 周边酒店预订

主办单位: IEEE Electronics Packaging Society International Microelectronics and Packaging Society Europe - iMAPS Europe

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        会议内容


        会议简介

        The European Microelectronics and Packaging Conference (EMPC) is the established international forum for engineers working in the field and others wanting to learn from this leading event.

        EMPC-2019 in Pisa offers the best of microelectronics packaging and interconnection technologies, providing top quality coverage of technological innovation in this field. The four days will comprise Tutorials/Short Courses and the Conference and Exhibition during 16thto 19thSeptember at the Palazzo Dei Congressi, an ideal venue which includes excellent lecture auditoria, exhibition space and a great social venue. The event will be complemented by social events for which IMAPS has a great tradition.

        Pisa where tradition, art, culture and business meet harmoniously is ideally located also to extend your visit in Italy.

        See you in Pisa!

        征稿信息
        重要日期

        初稿截稿日期:2019-01-15

        征稿简介

        TOPICS

        • ADVANCED PACKAGING

        Single Chip and Multi Chip Packaging, Wafer Level Packaging, 3D-WLP, 3D-IC, CoB, SiP, SoC, Systems-Integration Technologies, Embedded Passives on Wafers and Substrates, High Frequency and High Power Packaging, LTCC Technologies, Micro-Vias and Build-Up Technologies, Lab-on-Chip, Lab-on-Substrate, Molecular Electronics.

        • SUBSTRATE TECHNOLOGIES

        Inorganics, Organics, Co-fired, Flexibles, HD PCBs, Laminates, Printed, Microfluidics, Substrates Design and Technologies.

        • INTERCONNECTION TECHNOLOGIES

        Thick and Thin Film Technologies, Wire Bonding, Bumping, Flip Chip Bonding, Cu/Low-k Wafers, Through Silicon Vias, Advances in Soldering, Adhesive Joining, Connectors.

        • MORE THAN MOORE

        The future of IC shrinkage, the future options for IC packaging.

        • MEMS

        MEMS Based Sensors and Actuators Packaging, RF-MEMS, Optical MEMS, Bio-MEMS, WiFi modules.

        • OPTOELECTRONICS

        Silicon Photonics, Power LED Assembly, Packaging and Light Guiding, Packaging of Optoelectronic Modules suitable for Gb/s Fibre OpticCommunication, LiFi modules.

        • SOLAR ENERGY & PHOTOVOLTAICS

        Packaging Design to improve Efficiency of Photovoltaic modules, Reliability and Qualification Approaches.

        • NANO TECHNOLOGIES

        Smart Materials, Interconnections, Nano-Scale Packaging: Applications and Reliability.

        • GREEN ELECTRONICS

        Recovery and Recycling, Base material technologies.

        • MEDICAL ELECTRONICS

        Applications, Design, Development, Manufacturing that comply with complex and demanding regulations and market requirements.

        • POWER ELECTRONICS

        Application in Consumer, Telecom, Automotive, Wearable, Space and Defence, Fuel Cells, Battery Technologies.

        • SMART TEXTILES

        Wearables, Materials, Technologies, Applications, Markets, Reliability.

        • MANUFACTURING TECHNOLOGIES AND MATERIALS

        Process Development, New Equipment, Clean Room Technologies, Yield Improvement, Cost and Cycle Time Reduction, Green Manufacturing, Micromachining, Dispensing, Printing, Deposition, Adhesives, Encapsulants, Underfills, Moulding Compounds, Advanced Solder Alloys, Halogen Free Materials, Dielectrics, Ceramics.

        • MODELLING

        Electrical Modelling and Signal Integrity: Time and Frequency Domain Analysis of Interconnection and Packaging Technologies, Thermal Characterisation and Cooling Solutions, Modelling and Simulation Methodology for Characterisation of Advanced Packaging, Modules and Systems, Novel Cooling Techniques, Mechanical Modelling and Structural Integrity, Thermo-Mechanical Stress Analysis, Vibration and Shock Tests.

        • THERMAL MANAGEMENT

        Techniques, Heatsinks, Heat pumping.

        • RELIABILITY and QUALITY

        Specialised topics, Components, Counterfeits, Board and System Level Reliability Assessment, Failure Analysis, Interfacial Adhesion, Accelerated Testing, Reliability Engineering, Inspection and Test, Obsolescence Engineering, Prognostics.

        • COMPUTING

        Ambient Intelligence methods and products, Circuits and Systems, Touch Screen technologies.

        • APPLICATIONS

        Medical, Bio-Tec, Telecoms, Mobile, Smart Phones, RFID, Automotive, Aerospace, Robotics, Consumer, Structural

        • BUSINESS ASPECTS

        Electronics and Photonics, In-house or Outsource?, Markets, Supply Chain, Distribution, Microelectronics packaging and assembly industry

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        主办方:IEEE Electronics Packaging Society

        介绍:IEEE Electronics Packaging Society于2019年9月14日举办2019 IEEE Holm Conference on Electrical Contracts。

        主办方:International Microelectronics and Packaging Society Europe - iMAPS Europe

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