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首页 > 商务会议 > 加工制造会议 > 2017中国国际半导体技术大会(CSTIC) 更新时间:2017-01-20T09:58:03

2017中国国际半导体技术大会(CSTIC)
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2017中国国际半导体技术大会(CSTIC) 已截止报名

会议时间: 2017-03-12 08:00至 2017-03-13 18:00结束

会议地点: 上海  上海国际会议中心  上海市浦东新区滨江大道2727号 周边酒店预订

主办单位: SEMICON China

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        会议通知

        会议内容 主办方介绍


        2017中国国际半导体技术大会(CSTIC)

        2017中国国际半导体技术大会(CSTIC)宣传图

        中国国际半导体技术大会(CSTIC) 2017

        China Semiconductor Technology International Conference (CSTIC) 2017


        Plan now to participate at CSTIC 2017, one of the largest and the most comprehensive annual semiconductor technology conferences in China and Asia since 2000. Organized by SEMI and  IEEE-EDS , co-organized by IMEC and ICMTIA(The Integrated circuit Materials Industry Technology Innovation Alliance), and co-sponsored by ECS, MRS and CEMIA(the China Electronics Materials Industry Association), CSTIC 2017 will be held March 12-13, 2017 in Shanghai, China, in conjunction with SEMICON China 2017. The conference will have ten symposia cover all aspects of semiconductor technology with focus on manufacturing and advanced technology, including detail manufacturing processes, devices design, integration, materials, and equipment, as well as emerging semiconductor technologies, circuit design, and silicon material applications. Hot topics, such as memory technology, 3D integration, MEMS and Photovoltaic Technology will also be addressed in the conference.


        Date and Venue

        March 12-13, 2017

        Shanghai International Convention Center

        上海国际会议中心 中国上海浦东滨江大道2727号

        No.2727 Riverside Avenue Pudong, Shanghai 200120, China

        查看更多

        SEMICON China SEMICON China

        SEMICON China举办了2017中国国际半导体技术大会(CSTIC)和2017功率及化合物半导体论坛

        会议日程 (最终日程以会议现场为准)


        08:45–09:30 Opening Ceremony
          Opening Remarks by Conference Chair
          Opening Remarks by SEMI
          Opening Remarks by IMEC
          Opening Remarks by Chinese Government Representatives
          Presentation of SEMI Best Student Paper Awards and SEMI Best Young Engineer
          Paper Awards
           
        Meeting Room 3rd Floor Auditorium
           
        09:30 –10:10 Prof.Hiroshi Amano
          Nobel Laureate in Physics, 2014
          Director, Center for Integrated Research of Future Electronics, Institute of Materials and Systems for Sustainability, Nagoya University
           
        10:10–10:25 Coffee Break
           
        10:25–11:05 Dr.Tzu-Yin Chiu
          CEO and Executive Director,Semiconductor Manufacturing International Corp.(SMIC)
           
        11:05–11:35 Dr.Jong Shik Yoon
          Executive Vice President Foundry Business System-LSI,Samsung Electronics Co,LTD,Korea.
           
        11:35–12:05 Prof.Rao Tummala
          Joseph.M Pettit Chair Professor in ECE and MSE Director, 3D Microsystems
        Packaging Research Center Georgia Research Alliance Eminent Scholar
        Georgia Institute of Technology, Atlanta, Ga, USA
           
        12:05–13:30 7th Floor Grand Ballroom 1



        Panel Discussion

        Sunday, March 12, 2017

        Meeting Room: 3B

        17:00-18:00

        Moderator:

        Panel Members:
         

        Parallel Symposium Oral Sessions 

        Sunday, March 12, 2017
        13:30 – 18:00 Parallel Symposium Oral Sessions
           
        Coffee Break Conference Poster Session
           
        Monday,March 13,2017
        8:00-18:00 Parallel Symposium Oral Sessions
           


        Joint Sessions

        Symposium II and Symposium III-Lithograpy/Etch joint session
        Sunday, March 12, 2017

        Shanghai International Convention Cente

        Meeting Room: 3rd Floor Yellow River Hall黄河厅
        Session Chairs: Kafai Lai (IBM) and Ying Zhang (Applied Material)
         

        13:30-13:35 Opening Remarks
          Kafai Lai / Ying Zhang
        **13:35-14:05 TBD
          Donis Flagello, Nikon Research America
        **14:05-14:35 Patterning Technology Inflections for the 10n and Beyond Logic Nodes
          Rich Wise, Lam Research
        *14:35-14:55 Development of 250W EUV light source for HConsiderations for pattern fidelity control towards 5nm nodeVM lithography
          Hidetami Yaegashi, TEL
        *14:55-15:15 The Insertion of extreme ultraviolet lithography (EUVL) from patterning perspective
          Weimin Gao, Synopsys
        15:15-15:30 Coffee Break
           


        Symposium II and Symposium IX-DTCO Joint session
        Monday, March 13, 2017

        Shanghai International Convention Center

        Meeting Room: 3rd Floor Yellow River Hall黄河厅
        Session chairs: Leo Pang / Yiyu Shi

        *8:30-8:35 Opening Remarks
          Leo Pang / Yiyu Shi
        **8:35-9:05 Design Technology Co-optimization for Disruptive Patterning Schemes
          Puneet Gupta, UCLA
        **9:05-9:35 TBD
          Shaojun Wei, Tsinghua University
        *9:35-9:55 TBD
          Luigi Capodieci, Motovi.ai
        9:55-10:10 Coffee Break

        查看更多

        会议嘉宾 (最终出席嘉宾以会议现场为准)


        朱志敏

        布鲁尔科技有限公司

        博士

        王欣然

        南京大学

        教授

        SangBum Kim

        IBM

        researcher

        Dr. Qingtai Zhao

        Forschungszentrum Julich

        researcher

        Min-hwa Chi

        中芯国际

        副总裁

        参会指南

        会议门票 场馆介绍



        提前注册并付费
        (2017年2月20日前)

        注册费
        (2017年2月20日后)

        听众

        人民币 3,700

        人民币 4,200

        学生(持有效证件)

        人民币 2,100

        人民币 2,600

        晚宴(3月12日18:00-20:00)

        人民币 600

        人民币 800

        查看更多

        上海国际会议中心 上海国际会议中心

        交通指南:

            地铁二号线陆家嘴站、外滩观光隧道、583、621、623、776、778、870、872路、申高线、旅游江园线(滨江大道终点站)、82、85、581B、795路、陆家嘴环线(陆家嘴地铁站终点站)、81、797、983、旅游3号线、锦江观光巴士到东方明珠后步行5分钟即到。

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        标签: 半导体 CSTIC

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